Polovodiče

This part of IEC 62629 specifies the standard measurement methods and measurement conditions for determining the optical properties of aerial displays. This document excludes image quality of aerial displays, such as MTF and resolution measurements.

This part of IEC 62047 specifies the requirements and testing method to measure the bending strength of microstructures which are fabricated by micromachining technology used in silicon-based micro-electromechanical system (MEMS).

This document is applicable to the in-situ bending strength measurement of microstructures manufactured by microelectronic technology process and other micromachining technology.

With the devices scaling, the bending strength degradation, induced by defects and contaminations, becomes severer. This standard specifies an in­-situ testing method of the bending strength based on MEMS technique. This document does not need intricate instruments (such as scanning probe microscopy and nanoindenter) and special test specimens.

Since in-situ on-chip tester in this standard and device are fabricated with the same process on the same wafer, this document can give some practical reference for the design part.

This part of IEC 62047 specifies the requirements and testing method to measure the tensile strength of nanoscale membrane(length from 100μm to 5000μm, width from 100μm to 1000μm,thickness from 50nm to 500nm) which is fabricated by micromachining technology used in silicon-based micro-electromechanical system (MEMS).

This document is applicable to in-situ tensile strength measurement of nanoscale membrane manufactured by microelectronics technology and related micromachining technology.

With the devices scaling, the tensile strength degradation, induced by defects and contaminations, becomes severer. This standard specifies an in-situ testing method of the tensile strength of nanoscale membrane based on a MEMS technique. This document does not need intricate instruments (such as scanning probe microscopy and nanoindenter) and special test specimens.

Since in-situ on-chip tester in this standard and device are fabricated with the same process on the same wafer, this document can give some practical reference for the design part.

This part of IEC 62047 specifies the requirements and testing method to measure the bending strength of microstructures which are fabricated by micromachining technology used in silicon-based micro-electromechanical system (MEMS).

This document is applicable to the in-situ bending strength measurement of microstructures manufactured by microelectronic technology process and other micromachining technology.

With the devices scaling, the bending strength degradation, induced by defects and contaminations, becomes severer. This standard specifies an in­-situ testing method of the bending strength based on MEMS technique. This document does not need intricate instruments (such as scanning probe microscopy and nanoindenter) and special test specimens.

Since in-situ on-chip tester in this standard and device are fabricated with the same process on the same wafer, this document can give some practical reference for the design part.