Polovodiče

Oblast zaměření: Polovodiče
Komise : IEC/SC 47F (Micro-electromechanical systems)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 4.11.2020
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This part of IEC 62047 specifies a test method for measuring the adhesion strength of metal powder paste in the electrical interconnection between micro-electromechanical systems (MEMS) and a circuit board.  The typical examples of the metal powder paste are anisotropic conductive paste, solder paste, and nanoscale metallic inks. The pattern diameter of the metal powder paste ranges from 10 ㎛ and 500 ㎛. As the dimensions of MEMS decrease below 500 ㎛ and 3-dimensional assembly of MEMS is needed, the adhesion between the MEMS and metal powder paste plays a critical role in transferring the devices on the powder paste. In this test method, a uniaxial compression load is applied to a metal powder paste using a plano-convex shape glass lens simulating an actual device; then the adhesion strength is measured by retracting the lens. This test method is useful when the adhesion strength should be analyzed by considering the actual contact area between the device and metal powder particles.

Oblast zaměření: Polovodiče
Komise : IEC/SC 47F (Micro-electromechanical systems)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 25.11.2020
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This part of IEC 62047 specifies the terminology, essential ratings and characteristics, and measuring methods of RF (Radio Frequency) MEMS (Micro-Electro-Mechanical Systems) circulators and isolators.

Oblast zaměření: Polovodiče
Komise : IEC/TC 47 (Semiconductor devices)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 15.12.2020
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This part of IEC 63244-1 provides general requirements and specifications of the semiconductor devices for the performance and reliability evaluations of wireless power transfer and charging systems.  For the performance evaluations, this part covers various characterization parameters and symbols, general system diagrams, and test setups and test conditions. This part gives also classifications of the wireless power transfer technologies.

Oblast zaměření: Polovodiče
Komise : IEC/TC 47 (Semiconductor devices)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 15.12.2020
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This part of IEC 60749 details the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components.

These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow.

NOTE It is recommended that the moisture absorption parameters used in this standard be obtained from the material suppliers (such as the resin supplier).

Oblast zaměření: Polovodiče
Komise : IEC/TC 47 (Semiconductor devices)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 15.12.2020
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This part of IEC 60749 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.

The purpose of this standard is to prescribe a standardized test method and reporting procedure. This is not a component qualification test and is not meant to replace any system level drop test that may be needed to qualify a specific handheld electronic product. The standard is not meant to cover the drop test required to simulate shipping and handling-related shock of electronic components or PCB assemblies. These requirements are already addressed in test methods such as IEC 60749-10. The method is applicable to both area array and perimeter-leaded surface mounted packages.

This test method uses an accelerometer to measure the mechanical shock duration and magnitude applied which is proportional to the stress on a given component mounted on a standard board. The test method described in IEC 60749-40 uses strain gauge to measure the strain and strain rate of a board in the vicinity of a component. The detailed specification states which test method is to be used.

Oblast zaměření: Polovodiče
Komise : IEC/TC 47 (Semiconductor devices)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 22.12.2020
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This part of IEC 62830 specifies terms, definitions, symbols, test, and evaluation methods used to determine the performance characteristics of flexible and stretchable supercapacitors for practical use in low power electronics such as energy storage devices for energy harvesting, flexible and stretchable electronics, low-power devices, IoT applications, etc. This document is applicable to all the flexible and stretchable supercapacitors for consumers and manufacturers, without any limitations of device technology and size.