Polovodiče

Oblast zaměření: Polovodiče
Komise : IEC/TC 47 (Semiconductor devices)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 27.08.2019
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This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering.

In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more controllable conditions. This procedure determines whether devices are capable of withstanding the soldering temperature encountered in printed wiring board assembly operations, without degrading their electrical characteristics or internal connections.

This test is destructive and may be used for qualification, lot acceptance and as a product monitor.

The heat is conducted through the leads into the device package from solder heat at the reverse side of the board. This procedure does not simulate wave soldering or reflow heat exposure on the same side of the board as the package body.

Oblast zaměření: Polovodiče
Komise : IEC/SC 47F (Micro-electromechanical systems)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 11.09.2019
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This part of IEC 62047 specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under mechanical stress and strain, and test conditions for appropriate quality assessment. Specifically, this document specifies test methods and test conditions for measuring the durability of a DUT under temperature and humidity conditions and applied voltages. It further applies to evaluations of direct piezoelectric properties in piezoelectric thin films formed primarily on silicon substrates, i.e., piezoelectric thin films used like as acoustic sensor, cantilever type sensor.

This document does not cover reliability assessments, such as methods of predicting the lifetime of a piezoelectric thin film based on a Weibull distribution.

Oblast zaměření: Polovodiče
Komise : IEC/TC 47 (Semiconductor devices)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 11.09.2019
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This part of IEC 62830 defines terms, definitions, symbols, configurations, and test methods that can be used to evaluate and determine the performance characteristics of linear sliding mode triboelectric energy harvesting devices for practical use. This document is applicable to energy harvesting devices for consumer, general industries, military and aerospace applications without any limitations on device technology and size.

Oblast zaměření: Polovodiče
Komise : IEC/TC 110 (Electronic display devices)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 25.09.2019
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This document specifies the standard measurement conditions and measuring methods for determining the parameters of image quality for full-frame laser projection displays integrating the projection devices and screens. The front and rear projection screens are included in this document. Other display devices, such as raster-scanned (flying spot) projection devices, are not included.