Obecné elektrotechnické normy

Oblast zaměření: Supravodivost
Komise : IEC/TC 90 (Superconductivity)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 28.05.2019
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This part of IEC 61788 specifies a test method for the determination of the residual resistance ratio (RRR) of Nb-Ti and Nb3Sn composite superconductors with Cu, Cu-Ni, Cu/Cu-Ni and Al matrix. This method is intended for use with superconductor specimens that have a monolithic structure with rectangular or round cross-section, RRR value less than 350, and cross-sectional area less than 4 mm2. In the case of Nb3Sn, the specimens have received a reaction heat-treatment.

Komise : IEC/TC 89 (Fire hazard testing)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 28.05.2019
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This part of IEC 60695 gives guidance on:

a)  the optical measurement of obscuration of smoke;

b)  general aspects of optical smoke test methods;

c)  consideration of test methods;

d)  expression of smoke test data;

the relevance of optical smoke data to hazard assessment.

This basic safety publication shall be used by technical committees in the preparation of standards in accordance with the principles laid down in IEC Guide 104 and ISO/IEC Guide 51.

One of the responsibilities of a technical committee is, wherever applicable, to make use of basic safety publications in the preparation of its publications.

Komise : IEC/TC 89 (Zkoušení požárního nebezpečí)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 28.05.2019
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This part of IEC 60695 provides guidance on the following:

a)  general aspects of corrosion damage test methods;

b)  methods of measurement of corrosion damage;

c)  consideration of test methods;

d)  relevance of corrosion damage data to hazard assessment.

This basic safety publication shall be used by technical committees in the preparation of standards in accordance with the principles laid down in IEC Guide 104 and ISO/IEC Guide 51.

One of the responsibilities of a technical committee is, wherever applicable, to make use of basic safety publications in the preparation of its publications.

Komise : IEC/TC 89 (Fire hazard testing)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 28.05.2019
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This part of IEC 60695-9 presents a summary of published test methods that are used to determine the surface spread of flame of electrotechnical products or materials from which they are formed.

It represents the current state of the art of the test methods and, where available, includes special observations on their relevance and use.

The list of test methods is not to be considered exhaustive, and test methods that were not developed by IEC TC89 are not to be considered as endorsed by IEC TC89 unless this is specifically stated.

This summary cannot be used in place of published standards which are the only valid reference documents.

This basic safety publication is intended for use by technical committees in the preparation of standards in accordance with the principles laid down in IEC Guide 104 and
ISO/IEC Guide 51.

One of the responsibilities of a technical committee is, wherever applicable, to make use of basic safety publications in the preparation of its publications. The requirements, test methods or test conditions of this basic safety publication will not apply unless specifically referred to or included in the relevant publications.

Komise : IEC/TC 119 (Printed electronics)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 5.06.2019
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This part of IEC 62899 specifies mechanical and thermal test methods for the determination of reliability characteristics of printed flexible gas sensor, which is operated at relatively low temperature and composed of flexible substrate, electrode, and gas sensing layer.

Komise : IEC/TC 119 (Printed electronics)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 12.06.2019
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This International Standard specifies the measurement methods of the edge waviness of the printed patterns in printed electronics.

Komise : IEC/TC 119 (Printed electronics)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 12.06.2019
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This part of IEC 62899 specifies a test method of displacement current measurement (DCM) for the printed thin film transistor or OTFT.

Oblast zaměření: Hliníkové elektrické vodiče
Komise : IEC/SC 46F (RF and microwave passive components)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 12.06.2019
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This part of IEC 61169, which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for RF coaxial connectors with inner diameter of outer conductor 4,13 mm(0,163in) with threaded coupling with a characteristic impedance of 50Ω(type SMA).

This document prescribes mating face dimensions for high performance connectors – grade 1, dimensional details of standard test connectors-grade 0, gauging information and tests selected from IEC 61169-1, applicable to all detail specifications relating to series SMA RF connectors.

This specification indicates recommended performance characteristics to be considered when writing a detail specification and it covers test schedules and inspection requirements for assessment levels M and H.

The SMA types RF coaxial connectors which are used with all kinds of RF cables and microstrips in microwave transmission systems. The operating frequency is up to 18 GHz. These connectors can be intermated with 3,5mm (IEEE287-2007) and 2,92mm (IEC61169-35) connectors.

NOTE Metric dimension are original dimensions. All undimensioned pictorial configurations are for reference purpose only.

Oblast zaměření: Hliníkové elektrické vodiče
Komise : IEC/SC 46F (RF and microwave passive components)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 19.06.2019
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This part of IEC 61169, which is a sectional specification (SS), provides information and rules for  the  preparation  of  detail  specifications  (DS)  for  RF  coaxial  connectors  which  may preferably be used with RF cables 60096 IEC 50-3 of IEC 60096-2. These connector patterns are  for  low  power,  quick  connect/disconnect  applications  using  a  bayonet  type  coupling mechanism and are commonly known as type "BNC".

It describes the interface dimensions for general purpose connectors, dimensional details for standard test connectors together with gauging information and the mandatory tests selected from IEC 61169-1, applicable to all DS relating to type BNC connectors.

This specification indicates the recommended performance characteristics to be considered when writing a DS and covers test schedules and inspection requirements.

Komise : IEC/TC 119 (Printed electronics)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 26.06.2019
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This part of the IEC 62899 defines measurement methods for properties of stretchable substrates, for forming stretchable functional layers by printing (conductive and insulating). If the same type of materials as the substrates are used for the cover lay film, this standard is also applicable to measurement for them. This standard is intended to supplement the content to IEC62899-201.

Stretchable substrates handled by this standard apply to substrates subjected to repeated bending with wiring elements demanding high level performance, for example fabric integrated wearable devices, skin patchable devices, and so on.

Komise : IEC/TC 15 (Solid electrical insulating materials)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 26.06.2019
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This sheet 8 of IEC 60455-3 gives the requirements for resins for power cable accessories that conform to this specification and meet established levels of performance. However, the selection of a material by a user for a specific application should be based on the actual requirements necessary for adequate performance in that application and not on this specification alone.

These materials are designed to be used in low and medium voltage cable accessories and as such, electrical performance must be proven as part of the assembly. Examples of this are described in EN 50393 and IEC 60502-4 series.

Komise : IEC/TC 119 (Printed electronics)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 23.07.2019
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This standard specifies a measurement method for the peel strength of printed layer on flexible substrate in printed electronics. This method describes a 90° peel process. The test method can be used to characterize any printed layer or coating, e.g. dielectric films. The method described in this document is to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.