Tekutiny pro použití v elektrotechnice

Komise : IEC/TC 119 (Printed electronics)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 5.06.2019
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This part of IEC 62899 specifies mechanical and thermal test methods for the determination of reliability characteristics of printed flexible gas sensor, which is operated at relatively low temperature and composed of flexible substrate, electrode, and gas sensing layer.

Komise : IEC/TC 119 (Printed electronics)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 12.06.2019
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This International Standard specifies the measurement methods of the edge waviness of the printed patterns in printed electronics.

Komise : IEC/TC 119 (Printed electronics)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 12.06.2019
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This part of IEC 62899 specifies a test method of displacement current measurement (DCM) for the printed thin film transistor or OTFT.

Komise : IEC/TC 119 (Printed electronics)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 26.06.2019
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This part of the IEC 62899 defines measurement methods for properties of stretchable substrates, for forming stretchable functional layers by printing (conductive and insulating). If the same type of materials as the substrates are used for the cover lay film, this standard is also applicable to measurement for them. This standard is intended to supplement the content to IEC62899-201.

Stretchable substrates handled by this standard apply to substrates subjected to repeated bending with wiring elements demanding high level performance, for example fabric integrated wearable devices, skin patchable devices, and so on.

Komise : IEC/TC 119 (Printed electronics)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 23.07.2019
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This standard specifies a measurement method for the peel strength of printed layer on flexible substrate in printed electronics. This method describes a 90° peel process. The test method can be used to characterize any printed layer or coating, e.g. dielectric films. The method described in this document is to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.