Elektromechanické součástky

This International Standard defines requirements for component specificiations of electronic components that are intended for usage in surface mount technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications.

The objective of this standard is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent (e.g. cleaning, inspection) processes during assembly. This standard defines tests and requirements that need to be part of any SMD component general, sectional or detail specification. In addition, this standard provides component users and manufacturers with a reference set of typical process conditions used in surface mount technology. 

Some of the requirements for component specifications in this standard are also applicable to components with leads intended for mounting on a circuit board. Cases for which this is appropriate are indicated in the relevant sub-clauses.

This document specifies the reflow soldering ability test method components mounted on the organic rigid printed boards, reflow heat resistance test method for the organic rigid printed boards, and reflow soldering ability test method for the organic rigid printed boards land in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.

The printed boards materials for this organic rigid printed boards are epoxide woven E-glass laminated sheet that be specified in IEC61249-2 series.

The objective of this standard is to ensure that the solder joint and the printed boards land soldering ability. In addition, test methods are provided to ensure that the printed boards can resist against the heat load to which it is exposed during soldering.