Elektromechanické součástky

91/1579/CDV - IEC 61189-5-504 ED1 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)
Oblast zaměření: Elektromechanické součástky
Komise : IEC/TC 91 (Electronics assembly technology)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 20.08.2019
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This part of IEC 61189-5 is a test method designed to determine the proportion of soluble ionic residues present upon a circuit board, electronic component or assembly that are within acceptable limits to avoid their deleterious effects upon the intended electrical performance. The conductivity of the solution used to dissolve the ionic residues is measured to evaluate the level of ionic residues

91/1578/CDV - IEC 60194-1 ED1 - Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies
Oblast zaměření: Elektromechanické součástky
Komise : IEC/TC 91 (Electronics assembly technology)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 20.08.2019
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48B/2743/CDV - IEC 60512-9-5 ED2 - Connectors for electrical and electronic equipment - Tests and measurements - Part 9-5: Endurance tests - Test 9e: Current loading, cyclic
Oblast zaměření: Elektromechanické součástky
Komise : IEC/SC 48B (Connectors)
Původce: ISO\IEC\CEN\CENELEC
K připomínkám do: 8.10.2019
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This part of IEC 60512, when required by the detail product specification, is used for testing connectors or solderless connections within the scope of technical committee 48. It may also be used for similar devices when specified in a detail product specification.

The object of this document is to detail a standard method for subjecting solderless connections to thermal stress conditioning by cyclic current loading.