Elektromechanické součástky

This test method measures changes to the surface insulation resistance of a pre-selected material set on a representative test coupon and quantifies the deleterious effects of improperly used materials and processes that may lead to decreases in electrical resistance.

An assembly process involves a number of different process materials including solder flux, solder paste, solder wire, underfill materials, adhesives, staking compounds, temporary masking materials, cleaning solvents, conformal coatings and more. The test employs two different test conditions of 85 °C and 85% relative humidity (RH), preferred for a process that includes cleaning, or 40 °C and 90% relative humidity (RH), preferred for processes where no cleaning is involved. 

Note     40°C and 93% RH may be used as an alternative to 40°C and 90% RH.  Additional information is provided in 5.4 and Annex A.5.1.

Testing is material (set) and process / equipment specific. Qualifications should be performed using the production intent equipment, processes and materials.

This part of IEC 61189-5 is used to quantify the deleterious effects of flux residues on surface insulation resistance (SIR) in the presence of moisture.

Interdigitated comb patterns comprising long parallel electrodes on an IPC B53 standardized test coupon shall be used for the evaluation. Coupons shall be conditioned and measurements taken at a high temperature and humidity. The electrodes are electrically biased during conditioning to facilitate electrochemical reactions, see Figure 1 and Figure 3.

Reference should be made to IEC TR 61189-5-506 that examined different geometry comb patterns: 400mm x 500mm; 400mm x 200mm; and 318mm x 318mm.

Specifically, this method is designed to simultaneously assess:

Leakage current caused by ionized water films and electrochemical degradation of test vehicle, (corrosion, dendritic growth).

Provide metrics that can appropriately be used for binary classification (e.g. go/no go; pass/fail)

Compare, rank or characterize materials and processes.

This test is carried out at high humidity and heat conditions.

This part of IEC 60068 outlines Test T, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58.

This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.

The procedures in this standard include the solder bath method and soldering iron method.

The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can be resistant to the heat load to which it is exposed during soldering.

NOTE Information about wetting time and wetting force can be obtained by test methods using a wetting balance. See IEC 60068-2-69 (solder bath and solder globule method for SMDs).

This part of IEC 61076 covers 8-way, shielded, free and fixed rectangular connectors for I/O and data transmission with frequencies up to 500 MHz. It is intended to specify the common dimensions, mechanical, electrical and environmental characteristics and tests for this family of connectors.

Connectors complying with this standard provide an ingress protection level of IP20; however, they are particularly suited for industrial environments with a high level of vibration.

NOTE 1 In terms of the MICE system as defined in ISO/IEC 11801-1, the connector matches the requirements of the M3I1C3E3 levels.

There are two classes of connectors defined in this document, indicated by “class A” and “class B” which distinguish by some electrical and mechanical characteristics to meet the particular sets of requirements of some industrial applications.

NOTE 2 Class A meets the requirements defined in Ed.1 of this standard.

NOTE 3 With the two classes A and B, the two codings Type I and II, and the two sets of transmission requirements according to the component categories Cat 5 and Cat 6A as defined in ISO/IEC 11801, this document specifies 2 x 2 x 2 = 8 variants.

All connectors covered by this standard feature a current-carrying capacity beyond the minimum requirement of 0,75 A per pin for an ambient temperature of 60° C as defined in ISO/IEC 11801‑1.

NOTE 4 The current-carrying capacity is given by the current-temperature derating defined in this standard and dependent on the wire size of the cable attached to the connector.

NOTE 5 With a current-carrying capacity of 0,5 A per pin and with matching the requirement of withstanding the test current of 2 A for unmating under load as defined in IEC 60512-99-002, the connectors covered by this standard support the highest Power over Ethernet level as defined by IEEE 802.3bt (100 W PoE++ Type 4).

This International Standard is applicable to housed scintillators for registration and spectrometry of alpha-, beta-, gamma-, X-ray and neutron radiation.

The main parameters such, as a light output and intrinsic resolution, are established. The Standard specifies the requirements for the testing equipment and test methods the basic parameters of housed scintillators, such as:

the direct method is applicable to measure the light output of housed scintillators based on scintillation material. The housed scintillators certified by this method can be as working standard of housed scintillators (hereinafter - working standard) when performing measurements by a relative method of comparison.

the relative method of comparison with the working standard is applicable to housed scintillators based on the same scintillation material as the working standard.

The standard does not apply to gas or liquid scintillators and scintillators for counting and current modes.

The numerical values of the parameters should be set to the specific type of scintillators in the specifications.

This part of IEC 60352 is applicable to spring clamp connections made with stripped wire without further preparation:

solid conductors of 0,32 mm to 3,7 mm nominal diameter (0,08 mm2 to 10 mm2 
cross-section), or

stranded conductors of 0,08 mm2 to 10 mm2 cross-section, or

flexible conductors of 0,08 mm2 to 10 mm2 cross-section

according to IEC 60228 or IEC 60189-3 for use in electrical and electronic equipment and components.

Information on materials and data from industrial experience is included in addition to the test procedures to provide electrically stable connections under prescribed environmental conditions.

The object of this part of IEC 60352 is to determine the suitability of spring clamp connections under specified mechanical, electrical and atmospheric conditions.

NOTE IEC Guide 109 advocates the need to minimize the impact of a product on the natural environment throughout the product life cycle. It is understood that some of the materials permitted in this standard may have a negative environmental impact. As technological advances lead to acceptable alternatives for these materials, they will be eliminated from this standard.